Dong A University Students Access Semiconductor Training Program in Taiwan

On August 29, the Vice President of Minghsin University of Science and Technology in Taiwan visited Dong A University for a working session.

During the visit, Associate Professor Dr. Hsin-Te Liao met with students from the Electrical and Electronics Engineering Department at Dong A University to discuss the prospects of the semiconductor industry, Taiwan's potential in this field, and the advantages of the training program offered at Minghsin University.
Given that Vietnam, particularly Da Nang, has been focusing on attracting foreign direct investment (FDI) in the semiconductor sector, both Associate Professor Dr. Hsin-Te Liao and Mr. Luong Minh Sam, Chairman of the Board at Dong A University, expressed confidence that this is a crucial time to develop skilled engineers to meet future job market demands.
Mr. Luong Minh Sam also indicated that for students wishing to participate in this transfer program, in addition to specialized knowledge, they should dedicate significant time to improving their Chinese language skills to prepare for the transition and work in Taiwan.
Additionally, the leadership of both universities discussed specific exchange details before moving forward with a contract for implementing packaged training in semiconductor packaging and testing during the Human Resources Supply and Demand Connection Conference for the Semiconductor Industry in Da Nang, as part of the SEMICON Danang 2024 event on the afternoon of August 30.
It is known that on March 5, at Taiwan, Dong A University and Minghsin University of Science and Technology officially signed a cooperation agreement for high-tech workforce training. According to this agreement, Minghsin University collaborates with Dong A University to implement a 2+2 transfer program, awarding Bachelor's degrees issued by Minghsin University. Students participating in this program not only have the opportunity to receive a 100% scholarship for tuition and accommodation but also receive living expense support from companies, with job placements offered upon graduation.