Dong A University Signs 3 Collaboration Agreements in the Semiconductor Field at SEMICON Danang 2024

At the Workforce Connection Conference for the Semiconductor Industry in Da Nang, part of SEMICON Danang 2024, Dong A University secured three significant collaboration agreements.

1.Training Agreement with Ming Chuan University (Taiwan): Dong A University and Ming Chuan University signed a contract for training in semiconductor packaging and testing. This collaboration follows a previous agreement for high-tech workforce training established in March in Taiwan.

2.Memorandums of Understanding with Tecotec Group and K&H MFG (Taiwan): Dong A University also signed MOUs with Tecotec Group and K&H MFG for training and supplying manpower in the semiconductor field.

3.Research and Training Collaboration: An additional MOU was signed to coordinate and support research, training, and development in semiconductors and artificial intelligence between the Da Nang Semiconductor Design Research and Training Center and Dong A University.

Furthermore, Dong A University and Ming Chuan University have collaborated on a talent master's program for students in Information Technology and Electrical Engineering since 2022, marking the first master's program agreement with a Taiwanese university.
In early 2024, Dong A University also established collaborations focused on developing human resources in the semiconductor, robotics, and ICT sectors with institutions such as the Gyeongsan Creative Science and Technology Institute (Gyeongsangbuk Province), Jeju National University, Daegu Catholic University (South Korea), and the Da Nang Software Entrepreneurs Club (DSEC).
Additionally, Dong A University has partnerships for training, research, faculty and student exchanges, and internship programs with several universities in Taiwan.